• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Managing Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
    • E-mail: ijimt@ejournal.net
HOME > Archive > 2016 > Volume 7 Number 3 (Jun. 2016) >
IJIMT 2016 Vol.7(3): 86-89 ISSN: 2010-0248
doi: 10.18178/ijimt.2016.7.3.650

Analysis on the Impact of International Technology Transfer on China's Industrial Restructuring and Upgrading

Xie Shuyuan and Ma Huijun

Abstract— Under China’s New Normal, international technology transfer put forward new requirements for China's industrial development. Based on the meaning of international technology transfer, this paper analyzed the effects of technology transfer and TFP from the perspectives of technical input and technical output, and discussed theoretically the internal mechanism that international technology transfer effected the transformation and upgrading of industrial structure. In the end, the paper proposed some policy recommendations about China’s industrial restructuring and upgrading including establishment of a virtuous cycle mechanism on technology introduction, adjustment about industrial organizations and industrial technology policy, improvements on the legal and market environment of international technology transfer.

Index Terms— International technology transfer, industrial structure, restructuring and upgrading.

Xie Shuyuan is with Postgraduate Administration Brigade, Military Economics Academy, Wuhan, China (e-mail: xie.shuyuan@hotmail.com).
Ma Huijun is with The Department of Equipment Economics and Management, Military Economics Academy, Wuhan, China (e-mail: mahuijun_1965@126.com).

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Cite: Xie Shuyuan and Ma Huijun, " Analysis on the Impact of International Technology Transfer on China's Industrial Restructuring and Upgrading," International Journal of Innovation, Management and Technology vol. 7, no. 3, pp. 86-89, 2016.

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