• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Managing Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
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    • Article Processing Charge: 500 USD
IJIMT 2014 Vol.5(6): 443-448 ISSN: 2010-0248
DOI: 10.7763/IJIMT.2014.V5.556

Implementation of an Efficient Blind Signature Scheme

Aye Aye Thu and Khin Than Mya

Abstract— Nowadays, security of the user’s data is the major problem over internet. Privacy is one of the basic rights for individuals and institutions that need to preserve their confidentiality. Blind signature scheme are widely used for various applications of E-commerce like digital payments systems and electronic voting system where to maintain the privacy of customer is necessary. Blind signature is needed in applications that guarantee the anonymity of the participants. We propose blind signature scheme based on the Elliptic Curve Discrete Logarithm Problem (ECDLP) and it satisfies the requirements of blindness, correctness, unforgeability and untraceability. The propose scheme intended to develop the blind signature scheme with improve performance as compared to the other existing schemes. Most of blind signature scheme are very high at computational overhead and memory usage problem. This scheme desired to reduce time consuming problem by using Elliptic Curve Cryptography (ECC). The proposed scheme can apply in electronic voting system or cash system.

Index Terms— Blind signature, DLP, ECC, ECDLP, ecommerce, electronic voting system, ECDSA.

Aye Aye Thu is with the Hardware Department, Computer University, Hinthada, Myanmar (e-mail: suchiq13@gmail.com).
KhinThan Mya is with University of Computer Studies (Yangon), Myanmar (e-mail: khinthanmya@gmail.com).

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Cite: Aye Aye Thu and Khin Than Mya, " Implementation of an Efficient Blind Signature Scheme," International Journal of Innovation, Management and Technology vol. 5, no. 6, pp. 443-448, 2014.

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