Abstract—This study concerned with the use Experimental Design to analyze the quality problem of IC assembly factory.This study emphasized on Wire bonding process. The characteristic, such as ball size, ball height, and ball strength were depended on the parameter in the machine setting. The objectives of this study are to determine the appropriate settings of important control factors that affect a critical quality characteristic; the new response will meet the targets pecification and also minimize the defective rate in the Assembly process. This experiment design was the procedure to decrease the problem of bond on lead at assembly line. In the experimental machine, it was found that setting parameter of bonding force at 40- 60 grams, bonding power at 80 – 120 pulses, bonding time 10 - 30 ms were recommended for producing and controlling the ball size, ball height, ball strength, and wire strength to have the proper value.
Index Terms—Design of experiment, IC assembly manufacturing, wire bonding.
The authors are with the Faculty of Engineering, Department of Industrial Engineering, Eastern Asia University, Phathumtani, 12110,Thailand. (e-mail: Worlaluck@eau.ac.th)
Cite: Worlaluck Satianrangsarith and Mongkol Tirakanogsathit, "Design of Experiments Approach for Improving Wire Bonding Quality," International Journal of Innovation, Management and Technology vol. 3, no. 4, pp. 327 -331 , 2012.