• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Managing Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
    • E-mail: ijimt@ejournal.net
IJIMT 2013 Vol.4(1): 155-158 ISSN: 2010-0248
DOI: 10.7763/IJIMT.2013.V4.381

A Buffer Design for Mitigation Downtime Effect in an Automated Transfer Line

S. Prombanpong, J. Kaewyu, N. Thanadulthaveedech, and M. Matwangsang

Abstract—One of the problems in an automated transfer line is line breakdown which has an adverse effect to overall production rate. The causes of line breakdown can be due to scheduled tool change, tool adjustment, quality problem, equipment malfunction, etc. which can occur anytime during the production. Due to the fact that these unavoidable breakdowns cause every workstations to completely stop until the repair is completed. As a result, the production output will be less than that of expected and the required production rate cannot be met. One of the common solutions to mitigate this effect is to provide buffer stocks between workstations. However, the determination of appropriate buffer capacity is quite complicated. This paper therefore demonstrates the design of buffer capacity between workstations to alleviate break down effect in an automated transfer line.

Index Terms—Automated transfer line, Buffer design, breakdown analysis.

S. Prombanpong, J. Kaewyu, N. Thanadulthaveedech, and M. Matwangsang are with the Dept. of Industrial Engineering at King Mongkut’s University of Technology Thonburi (KMUTT), Bangkok, Thailand(e-mail: suksan.pro@gmail.com, koo_miin@hotmail.com, ploy_kung_2@hotmail.com, chompooh_ber @hotmail.com).

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Cite: S. Prombanpong, J. Kaewyu, N. Thanadulthaveedech, and M. Matwangsang, "A Buffer Design for Mitigation Downtime Effect in an Automated Transfer Line ," International Journal of Innovation, Management and Technology vol. 4, no. 1, pp. 155-158, 2013.

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