• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Managing Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
    • E-mail: ijimt@ejournal.net
HOME > Archive > 2012 > Volume 3 Number 4 (Aug. 2012) >
IJIMT 2012 Vol.3(4): 422-426 ISSN: 2010-0248
DOI: 10.7763/IJIMT.2012.V3.267
 

The Organizational Structure that Interpenetrates Knowledge inside the Company

Youngjae Koh

Abstract—The purpose of this paper is to reveal the organizationl structure that interpenetrates knowledge among the different businesses through process innovation. The knowledge interpenetrated inside the company enhances the product efficiency of the business unit which plans to promote process innovation with previous equipment used in different businesses. To reveal the organizational structure, this paper used a case study of process innovation that observed the production process of the Temperature Compensated Crystal Oscillator (TCXO) within Kyocera. To interpenetrate knowledge as a whole company, an interface organization is needed. This interface organization accumulates and diffuses this knowledge to the company during the period of process innovation. However, interface organization is not a business unit that produces key components. This suggests that the interfacing organization which accumulates knowledge related with businesses and functions do not necessarily have the possibility to accumulate knowledge that is related with key component.

Index Terms—Interfacing organization, interpenetration process, organizationl structure, process innovation.

 

Y. Koh is with the Hirao School of Management at Konan University ,Hyogo, Japan (e-mail: koh@center.konan-u.ac.jp).

 

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Cite: Youngjae Koh, "The Organizational Structure that Interpenetrates Knowledge inside the Company," International Journal of Innovation, Management and Technology vol. 3, no. 4, pp. 422 -426 , 2012.

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