• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Managing Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
    • E-mail: ijimt@ejournal.net
IJIMT 2018 Vol.9(1): 56-59 ISSN: 2010-0248
doi: 10.18178/ijimt.2018.9.1.787

Advantages of Integrating Technology Knowledge into an Undergraduate Curriculum

Nicholas Nam, Lonny Simonian, and Paul Weber

Abstract— Advancements in technology have made daily construction tasks both easier and more efficient, and presumably, will continue to do so. California Polytechnic State University, San Luis Obispo, CA, USA (Cal Poly) currently offers a Building Information Modeling (BIM) course, however, it is limited to certain application programs and the extent to which the course is offered for instruction is also limited. This paper is based on the results of a student senior project that explored the opinions of current Cal Poly Construction Management (CM) students on their views to successfully implant additional technology programs, and to which courses these programs could be integrated. Training on an expanding number of varying applications is necessary for internships. An analysis of the survey results indicates a strong consensus for the implementation of additional technology within the existing CM curriculum. The importance of technology within the new generation of builders is imperative to give students the resources they need to succeed in the construction environment.

Index Terms— BIM, curriculum, technology.

The authors are with California Polytechnic State University, San Luis Obispo (e-mail: nicknam@yahoo.com, lsimonia@calpoly.edu, pwaber@calpoly.edu).

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Cite: Nicholas Nam, Lonny Simonian, and Paul Weber, " Advantages of Integrating Technology Knowledge into an Undergraduate Curriculum," International Journal of Innovation, Management and Technology vol. 9, no. 1, pp. 56-59, 2018.

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