• ISSN: 2010-0248 (Print)
    • Abbreviated Title: Int. J. Innov.  Manag. Technol.
    • Frequency: Quarterly
    • DOI: 10.18178/IJIMT
    • Editor-in-Chief: Prof. Jin Wang
    • Executive Editor: Ms. Nancy Y. Liu
    • Abstracting/ Indexing: Google Scholar, CNKI, Ulrich's Periodicals Directory,  Crossref, Electronic Journals Library.
    • E-mail: ijimt@ejournal.net
IJIMT 2014 Vol.5(4): 323-326 ISSN: 2010-0248
DOI: 10.7763/IJIMT.2014.V5.534

Central Billing System for Personal Bills

Yi Huang and Bin Wang
Abstract— In this paper we propose a new central billing system for personal bills such as utility bills, telecom bills, credit card bills, tax bills, medical bills, etc. The proposed system consolidates all bills for one user so the user will not need to track and pay the bills individually. Personal users can save a lot of time and effort on paying bills every month and will less likely forget to pay for the bills thus avoiding paying late payment fines. Billing organizations such as utility companies, telecom companies and banks can benefit from this system by getting payments from users in time and sending out less physical mails for bills, which can save a lot of costs as well as save the planet’s resources. The proposed system can also provide functionalities for the users to track and view their expenses back in time and in different aspects online from anywhere. Expense reports can also be generated for all bills monthly, which is a very useful tool for users to know and plan their expenses.

Index Terms— Central billing system, consolidated bill, easy tracking, personal bills.

Yi Huang is with Research & Innovation, SAP Asia Pte Ltd, 1 Create Way, #14-01 Create Building, 138602, Singapore (e-mail: yi.huang01@sap.com).
Bin Wang is with Business Operations, SAP Asia Pte Ltd, 30 Pasir Panjang Road, #03-32, Mapletree Business City, 117440, Singapore (e-mail: jack01.wang@sap.com).


Cite: Yi Huang and Bin Wang, " Central Billing System for Personal Bills," International Journal of Innovation, Management and Technology vol. 5, no. 4, pp. 323-326, 2014.

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